Substrate holding method, substrate holding apparatus, exposure apparatus and exposure method
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
May 23, 2013
filing date -
May 23, 2013
priority date (Note) -
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Abstract
A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large.
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