Substrate support chuck cooling for deposition chamber
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
Apr 27, 2017
filing date -
Mar 15, 2013
priority date (Note) -
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Abstract
A substrate support chuck for use in a substrate processing system is provided herein. In some embodiments, a substrate support for use in a substrate processing chamber may include an electrostatic chuck having a top substrate support surface and a bottom surface, and a cooling ring assembly having a central opening disposed proximate the bottom surface of the electrostatic chuck, the cooling ring assembly including, a cooling section having a top surface thermally coupled to the bottom surface of the electrostatic chuck, the cooling section having a cooling channel formed in a bottom surface of the cooling section, and a cap coupled to a bottom surface of the cooling section and fluidly sealing the cooling channel formed in the cooling section.
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