Substrate liquid processing method, substrate liquid processing apparatus, and recording medium

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United States of America Patent

PATENT NO 9865483
SERIAL NO

14851388

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Abstract

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Disclosed is a substrate liquid processing method. The method includes: supplying a first processing liquid to a central portion of a substrate at a first flow rate by a first nozzle while rotating the substrate using a substrate holding unit; supplying a second processing liquid to a location between the central portion and an outer circumferential end of the substrate by a second nozzle while supplying the first processing liquid to the central portion of the substrate at the first flow rate; and changing the flow rate of the first processing liquid supplied from the first nozzle to a second flow rate lower than the first flow rate, so as to continue forming of the liquid film on the overall surface of the substrate while supplying the second processing liquid by the second nozzle to the substrate that is formed with a liquid film on the overall surface thereof.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goshi, Gentaro Kumamoto, JP 38 111
Higashi, Hiroyuki Kumamoto, JP 10 49
Otsuka, Takahisa Kumamoto, JP 22 90

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