Printed circuit board including under-fill dam and fabrication method thereof

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United States of America Patent

PATENT NO 9865480
SERIAL NO

13699275

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Abstract

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The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTDSEOUL SOUTH KEREAN SEOUL

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Bo-Yun Daejeon, KR 6 29
Choi, Byung-Ju Daejeon, KR 7 31
Jeong, Min-Su Daejeon, KR 10 59
Jeong, Woo-Jae Daejeon, KR 6 29
Lee, Kwang-Joo Daejeon, KR 13 54

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