Printed circuit board including under-fill dam and fabrication method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9865480
SERIAL NO

13699275

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTDYEOUI-DAERO YOUNGDUNGPO-GU SEOUL 07336

International Classification(s)

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  • 2011 Application Filing Year
  • H01L Class
  • 19146 Applications Filed
  • 15997 Patents Issued To-Date
  • 83.56 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20112012201320142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Bo-Yun Daejeon, KR 6 29
Choi, Byung-Ju Daejeon, KR 7 31
Jeong, Min-Su Daejeon, KR 10 59
Jeong, Woo-Jae Daejeon, KR 6 29
Lee, Kwang-Joo Daejeon, KR 13 54

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Patent Citation Ranking

  • 0 Citation Count
  • H01L Class
  • 0 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3689997611243481558461392216162801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05001000150020002500300035004000450050005500600065007000750080008500900095001000010500

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