Backside polisher with dry frontside design and method using the same

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United States of America Patent

PATENT NO 9865477
SERIAL NO

15052310

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Abstract

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The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a wafer stage that is operable to secure and rotate a wafer; a polish head configured to polish a backside surface of the wafer; an air bearing module configured to apply an air pressure to a front surface of the wafer; and an edge sealing unit configured to seal edges of the wafer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chih-Hung Hsin-Chu, TW 119 913
Hsu, Chia-Jung Changhua County, TW 104 506
Lin, Yi-An Taipei, TW 43 963

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