Substrate processing method and substrate processing apparatus
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United States of America Patent
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Jan 9, 2018
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app pub date -
Mar 30, 2016
filing date -
Apr 7, 2015
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Abstract
Disclosed is a substrate processing method that includes a water-repellency step, a rinse step, and a dry step. In the water-repellency step, a water-repellent agent which is heated to a first predetermined temperature and then reaches a second predetermined temperature lower than the first predetermined temperature, is supplied to a substrate. In the rinse step, a rinse liquid is supplied to the substrate after the water-repellency step. In the dry step, the rinse liquid on the substrate after the rinse step is removed.
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