Sputtering shield
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United States of America Patent
Stats
-
Jan 9, 2018
Issued Date -
N/A
app pub date -
Nov 29, 2010
filing date -
Nov 29, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A sputtering apparatus includes a sputtering cathode and a target overlying the sputtering cathode. A shield overlies the target and forms an aperture configured to direct sputtering particles onto a substrate. The shield includes a lower shield portion overlying the target, a channel outlet overlying the lower shield portion, and an upper shield portion overlying the channel. In some embodiments the shield includes a first shield and a second shield. The first shield includes a front gas injection outlet. The second shield overlies the first shield and forms the aperture. In various embodiments, the second shield is operable to adjust plasma confinement between the first shield and the second shield.
First Claim
Other Claims data not available
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International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01J Class
- 31.16 % this patent is cited more than
- 7 Age
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
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