Electronic component having multilayer structure and method of manufacturing the same

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United States of America Patent

PATENT NO 9865399
SERIAL NO

14876774

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Abstract

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An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDGYEONGGI DO KOREA SUWON SUWON GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Sung Hun Suwon-Si, KR 15 45
Chong, Won Sik Suwon-Si, KR 12 33
Lee, Chang Ho Seoul, KR 147 997

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