Multilayer substrate, design method of multilayer substrate, manufacturing method of semiconductor device, and recording medium
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Sep 8, 2015
filing date -
Apr 20, 2015
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Abstract
According to one embodiment, there is provided a multilayer substrate including a ground layer and a signal layer. The ground layer includes a mesh ground having multiple openings. The signal layer is laid above the ground layer and including multiple signal lines. The multiple openings include first openings and second openings. The first openings overlap a first signal line from among the multiple signal lines when seen through in a direction perpendicular to a surface of the multilayer substrate. The second openings overlap the first signal line when seen through in the direction perpendicular to the surface of the multilayer substrate. The first openings have a first form, and the second openings have a second form different from the first form.
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