Multilayer printed board and layout method for multilayer printed board
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Mar 11, 2015
filing date -
Nov 3, 2014
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Abstract
According to one embodiment, a multilayer printed board includes an insulating substrate, a differential signal wiring, and anti-pad regions. Distances between peripheries of the pad and a constant potential layer in each of the wiring layers are set so that a capacitance between the constant potential layers and a signal via included in a signal line constituting the differential signal wiring, which has a longer route from a transmission end to a reception end, is smaller than a capacitance between the constant potential layers and another signal via included in the other signal line.
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