Multistage boot image loading by configuration of a bus interface
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
Nov 3, 2015
filing date -
Nov 3, 2015
priority date (Note) -
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Abstract
An integrated circuit (IC) that includes a processor circuit can be booted by receiving, using a storage interface circuit of the IC, a first boot image from a nonvolatile memory chip. The first boot image is executed on a processor circuit of the IC to configure a bus interface module that is designed to communicate with a host device over a communication bus that links multiple devices and the IC. Using the bus interface module, a second boot image is received from the memory of the host device to a memory of the IC. The IC is booted by executing the second boot image.
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