Process control method and process control system
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United States of America Patent
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Jan 9, 2018
Grant Date -
Feb 18, 2016
app pub date -
Oct 31, 2014
filing date -
Aug 15, 2014
priority date (Note) -
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Abstract
A process control method is provided for performing a deposition process on a plurality of wafers of a batch. The process control method includes: deciding a placement location of the wafers of the batch according to the history information of a tool and the product information of the batch; calculating a target value of each placement location according to the placement location of the wafers of the batch and the history information of the tool; calculating a process parameter according to the history information of the tool, the product information of the batch, and the target value of each placement location; and performing a deposition process according to the placement location of the wafers of the batch and the process parameter.
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