Bonding method with peripheral trench
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Jul 25, 2014
filing date -
Jul 25, 2014
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Abstract
A device has planar components forming part of a stack on a support frame, such as a substrate and upper layer, for example a fiber optic scintillator/fiber optic plate, bonded together by an adhesive layer of well-defined thickness. The device is made by providing a trench in a peripheral recess extending in a marginal portion of the support frame. Excess adhesive is applied to one of the planar components, which are then brought together such that the adhesive layer of well-defined thickness is formed between the two components and surplus adhesive is collected in the trench.
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