Method of contacting substrate with probe card
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
Jul 18, 2013
filing date -
Jul 31, 2012
priority date (Note) -
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Abstract
A method of contacting a substrate with a probe card in a substrate inspection apparatus can inspect electrical characteristics of semiconductor devices on the substrate. A wafer W is transferred to a position facing a probe card 36 while being mounted on a chuck member 22 with a wafer plate 37 therebetween, and electrodes of semiconductor devices on the wafer W are contacted with probes of the probe card 36 by moving the wafer W and the wafer plate 37 toward the probe card 36 through an elevating device 43. Then, the wafer W is overdriven toward the probe card 36 and a contact state between the electrodes of the semiconductor devices and the probes of the probe card 36 is maintained by decompressing a space S between the probe card 36 and the wafer plate 37. Then, the chuck member 22 is separated from the wafer plate 37.
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