Vacuum vapor deposition method
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United States of America Patent
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Jan 9, 2018
Grant Date -
Aug 6, 2015
app pub date -
Apr 17, 2015
filing date -
Jul 10, 2009
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Abstract
In a vacuum vapor deposition method which is carried out at a vacuum vapor deposition apparatus including a plurality of linear-shaped vaporization sources, an equal-thickness surface is calculated with respect to each of a polarity of release holes. The equal-thickness surface indicates a surface where a deposition amount of vapor of a vaporization material released from the corresponding release hole is the same per unit time. Then, the vaporization containers are placed in such a manner that contact points of the equal-thickness surfaces all coincide with each other on a deposition surface of a substrate, each of the contact points being where the corresponding equal-thickness surface comes in contact with the surface of the substrate.
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