Thermally-conductive polycarbonate resin composition and molded product formed therefrom

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United States of America Patent

PATENT NO 9862870
SERIAL NO

14912963

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Abstract

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The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.

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Patent Owner(s)

Patent OwnerAddress
LOTTE ADVANCED MATERIALS CO LTDLISHUI CITY LISHUI JEONNAM SOUTH KOREA ALL THE WAY 334-27 YEOSU GYEONGSANGNAM-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeon, Byung Kuk Uiwang-si, KR 2 2
Kim, Nam Hyun Uiwang-si, KR 24 29
Lim, Jong Cheol Uiwang-si, KR 60 533
Shin, Chan Gyun Uiwang-si, KR 21 64

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