Electrically conductive adhesive composition, connection structure, solar battery module, and method for producing same

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United States of America Patent

PATENT NO 9862866
SERIAL NO

14640493

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Abstract

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An electrically conductive adhesive composition comprising electrically conductive particles containing a metal of which melting point is 220° C. or less, a thermosetting resin, and a thermal cationic polymerization initiator.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION13-9 SHIBA DAIMON 1-CHOME MINATO-KU TOKYO 105-8518

International Classification(s)

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  • 2015 Application Filing Year
  • C09J Class
  • 1204 Applications Filed
  • 830 Patents Issued To-Date
  • 68.94 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sukata, Shinichirou Tokyo, JP 15 24

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  • 0 Citation Count
  • C09J Class
  • 0 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges478071101 - 1011 - 2021 - 3031 - 400510152025303540455055606570758085

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