Systems and methods for substrate polishing end point detection using improved friction measurement
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United States of America Patent
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Jan 9, 2018
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app pub date -
Apr 27, 2012
filing date -
Nov 16, 2011
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Abstract
Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.
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