Via and trench filling using injection molded soldering
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Jul 20, 2016
filing date -
Jun 29, 2016
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Abstract
A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.
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