CIRCUIT BOARD ELEMENT
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United States of America Patent
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Jan 2, 2018
Grant Date -
Jan 11, 2018
app pub date -
Sep 22, 2016
filing date -
Jul 5, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. The first dielectric layer is disposed on the glass substrate and has a central region and an edge region. The edge region is in contact with the edge of the glass substrate, and the thickness of the central region is greater than the thickness of the edge region. The first patterned metal layer is disposed on the glass substrate and in the central region of the first dielectric layer.
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