Transparent flexible printed circuit board and method for manufacturing the same
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United States of America Patent
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-
Jan 2, 2018
Issued Date -
N/A
app pub date -
Aug 2, 2017
filing date -
Jun 30, 2017
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A transparent flexible printed circuit board (FPCB) of reduced thickness but good conductivity and transparency includes an insulating resin layer. The insulating resin layer has a first surface and a second surface. At least one through hole is defined in the insulating resin layer through the first surface and the second surface. A conductive wiring layer is formed on the first surface and a wiring layer is formed on the second surface. The conductive wiring layers are made of electrically conductive resin, and have wiring openings. A cover film covers each of the conductive wiring layers, and further infills the wiring openings.
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