Semiconductor device package with reinforced redistribution layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 2, 2018
Issued Date -
N/A
app pub date -
Dec 25, 2016
filing date -
Dec 25, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device package includes an encapsulation layer, a die, at least one trace stiffener, and a redistribution layer. The encapsulation layer has an opening. The die is disposed in the opening of the encapsulation layer. The redistribution layer is formed above the die and the encapsulation layer. The least one trace stiffener are formed on the redistribution layer above boundaries of the encapsulation layer and the die for reinforcing a structure of the redistribution layer above the boundaries of the encapsulation layer and the die.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully