Interconnection structure and manufacturing method thereof
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United States of America Patent
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Jan 2, 2018
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N/A
app pub date -
Mar 10, 2015
filing date -
Mar 10, 2015
priority date (Note) -
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Abstract
An interconnection structure and a manufacturing method thereof are provided. The interconnection structure includes a substrate, a conductive through via, a dielectric layer, and a conductive layer. The substrate has a first surface and a second surface opposite to each other. The conductive through via is disposed in the substrate and extended from the first surface beyond the second surface. The dielectric layer is disposed on the substrate, wherein the dielectric layer has an opening exposing a portion of the conductive through via. The top surface of the conductive through via protrudes from the bottom surface of the opening. The conductive layer is disposed in the opening and connected to the conductive through via.
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