Cu—Ni—Si based copper alloy
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 2, 2018
Issued Date -
N/A
app pub date -
Feb 15, 2013
filing date -
Apr 24, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A rolled Cu—Ni—Si based copper alloy having excellent strength, electric conductivity, and bending coefficient is provided. The rolled copper alloy comprises 1.2 to 4.5% by mass Ni, 0.25 to 1.0% by mass Si, and the balance Cu with inevitable impurities. In the direction transverse to the rolling direction, the rolled copper alloy has a bending coefficient of 130 GPa or more and an electrical conductivity of 30% ICAS or more.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully