Defect classification using CAD-based context attributes
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United States of America Patent
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Jan 2, 2018
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app pub date -
Apr 19, 2012
filing date -
Apr 19, 2012
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Abstract
A method for classification includes receiving an image of an area of a semiconductor wafer on which a pattern has been formed, the area containing an image location of interest, and receiving computer-aided design (CAD) data relating to the pattern comprising a CAD location of interest corresponding to the image location of interest. At least one value for one or more attributes of the image location of interest is computed based on a context of the CAD location of interest with respect to the CAD data.
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