Modular packaging with elevating screw
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United States of America Patent
Stats
-
Jan 2, 2018
Grant Date -
Oct 12, 2017
app pub date -
Apr 7, 2016
filing date -
Apr 7, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Modular packaging includes a solid state relay and a function module, wherein the function module comprises a housing containing a printed circuit board and an elevating screw. The elevating screw comprises a first end with an external threading and a second end with an external threading, where the elevating screw may be selectively altered between a first position and a second position within the housing. Related embodiments are disclosed.
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- F16B Class
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- 7 Age
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