Wafer processing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 2, 2018
Issued Date -
N/A
app pub date -
Aug 6, 2013
filing date -
Aug 10, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a method of treating a wafer in the state where the wafer is fixed on a support plate with an adhesive composition. Although the wafer is treated by a chemical, heating, or exothermic treatment, the method achieves sufficient adhesiveness during the step of treating a surface of the wafer and allows detachment of the support plate from the wafer without damaging the wafer or leaving the adhesive on the wafer after the wafer treating step. The method of treating a wafer of the present invention includes the steps of: fixing a wafer on a support plate via an adhesive composition containing a curable adhesive component to be crosslinked and cured by light irradiation or heating; crosslinking and curing the curable adhesive component by light irradiation or heating of the adhesive composition; treating a surface of the wafer fixed on the support plate by a chemical, heating, or exothermic treatment; and detaching the support plate from the treated wafer.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2013 Application Filing Year
- C09J Class
- 876 Applications Filed
- 717 Patents Issued To-Date
- 81.85 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C09J Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 2, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 2, 2029 |
