Heat sink, method for making the same, and electronic device having the same
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United States of America Patent
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Jan 2, 2018
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N/A
app pub date -
Aug 25, 2015
filing date -
Jun 24, 2015
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Abstract
A heat sink includes a connecting member, a first substrate, a second substrate, and a cooling medium. The connecting member is sandwiched between the first substrate and the second substrate, and defines at least one hole passing through the connecting member. Each hole includes a first end and a second end respectively enclosed by the first substrate and the second substrate to define a cavity. The cooling medium is filled in each cavity.
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