Fluid ejection head and process for making a fluid ejection head structure
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United States of America Patent
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Jan 2, 2018
Issued Date -
N/A
app pub date -
Oct 17, 2016
filing date -
Oct 17, 2016
priority date (Note) -
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Abstract
A fluid ejection head and a method of making a fluid ejection head. The method includes providing a semiconductor substrate containing a plurality fluid ejection actuators on a device surface thereof. The substrate is reactive ion etched to form one or more fluid supply vias therein. A flow feature layer is laminated to the substrate and is exposed to ultra violet (UV) radiation through a photo mask to provide UV exposed areas of the flow feature layer. The flow feature layer is heated to cross-link material in the UV exposed areas. A nozzle plate layer is laminated to the flow feature layer and exposed to UV radiation through a photo mask to provide UV exposed areas for nozzle holes. The nozzle plate layer is cross-linked with heat and the flow feature layer and nozzle plate layer are developed to form the flow features and nozzle holes in the respective layers.
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