Double diffused metal oxide semiconductor device and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 26, 2017
Issued Date -
N/A
app pub date -
Apr 18, 2017
filing date -
Sep 22, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention provides a DMOS device and a manufacturing method thereof. The DMOS device includes: a substrate, an epitaxial layer, a high voltage well, a body region, a gate, a source, a drain, a drift buried region and a buried region. A first PN junction is formed between the high voltage well and an upper surface of the substrate. From a cross-section view, along the channel direction, a second PN junction is formed between the drift buried region and the buried region or formed between the high voltage well and the buried region. Along the channel direction, the first PN junction and the second PN junction have respective depths. The depth is defined as a distance extending from the upper face of the epitaxial layer downward along a vertical direction. The depth of the second PN junction is shallower than the depth of the first PN junction.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully