Semiconductor device with stacking chips
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United States of America Patent
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Dec 26, 2017
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N/A
app pub date -
Dec 15, 2016
filing date -
Dec 15, 2016
priority date (Note) -
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Abstract
A semiconductor device includes a first chip, a spacer, and a second chip. The first chip and the spacer are disposed on a substrate. The second chip has a first half end portion disposed on a first half end portion of the first chip, and a second half end portion disposed on the spacer. The height of the spacer is substantially equal to the height of the first chip.
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