Method for producing an integrated circuit package and apparatus produced thereby
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United States of America Patent
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Dec 26, 2017
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app pub date -
Oct 29, 2015
filing date -
Dec 30, 2014
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Abstract
A processor-implemented method and integrated circuit package are provided. According to an implementation, a method of producing a chip package includes de-populating solder balls at selected locations in a fine pitch package, and providing test pads at the de-populated solder ball locations. In an example implementation, the method comprises receiving and modifying a package design. In an implementation, a row of test pads in an integrated circuit package is provided in a plurality of concentric annular rows, the row of test pads being adjacent an outer row of via-connected solder balls and adjacent an inner row of via-connected solder balls. In an implementation, test pads are located on a PCB-facing surface of the package at a subset of locations opposing at least one via position on a package-facing surface of the PCB. The test pads maintain a large number of signal pins and do not interfere with the via.
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