Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component

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United States of America Patent

PATENT NO 9852955
APP PUB NO 20170133281A1
SERIAL NO

15343117

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Abstract

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According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.

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Patent Owner(s)

Patent OwnerAddress
AMS AGPRESTERTEN AUSTRIA PREMSTAETTEN STEIERMARK

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bodner, Thomas Seiersberg, AT 16 44
Gehles, Helene Fuerth, DE 2 4
Siegert, Joerg Graz, AT 16 34

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