Lead frame and manufacturing method of lead frame

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United States of America Patent

PATENT NO 9852929
SERIAL NO

14885045

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Abstract

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A lead frame includes a lead frame body processed in a predetermined shape, and including a notched part provided at an end of the lead frame body, the notched part being used as a starting point of tape-removing, a resin leakproof tape stuck on a back surface of the lead frame body, and a region of a periphery of the notched part in the back surface of the lead frame body, the region being reduced in a strength of bonding between the resin leakproof tape and the lead frame body is reduced relative to other region.

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Patent Owner(s)

Patent OwnerAddress
MITSUI HIGH-TEC INCFUKUOKA PREFECTURE FUKUOKA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishibashi, Takahiro Fukuoka, JP 16 205

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