Method and apparatus for using cepstrum and wavelet based algorithms for wall thickness measurement
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United States of America Patent
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Dec 26, 2017
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app pub date -
Mar 9, 2011
filing date -
Mar 9, 2010
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Abstract
New techniques are provided for measuring the thickness of a pipe wall using ultrasonic reflections. The apparatus includes a signal processor that receives a signal containing information about ultrasonic pulses injected into a pipe wall; and determines a pipe wall thickness measurement based at least partly on decomposing the signal received in order to identify either peaks using a cepstrum analysis or repeated spacing using a wavelet analysis. The wavelet analysis includes dividing data in the signal received into a specific frequency component and a defined temporal component in order to detect correct pulses where multiple reflections are caused by irregularities in the pipe wall surface being measured. The cepstrum analysis includes processing repeating pulses in the signal in order to detect correct pulses where multiple reflections are caused by irregularities in the pipe wall surface being measured.
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