Polyamide resin composition for molded article exposed to high-pressure hydrogen and molded article made of the same
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United States of America Patent
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Dec 26, 2017
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Oct 26, 2015
filing date -
Feb 27, 2015
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Abstract
A polyamide resin composition for a molded article exposed to high-pressure hydrogen contains a polyamide 6 resin (A) and a polyamide resin (B) having a melting point, as determined by DSC, that is not higher than a melting point of the polyamide 6 resin (A) +20° C. and a cooling crystallization temperature, as determined by DSC, that is higher than a cooling crystallization temperature of the polyamide 6 resin (A), the polyamide resin (B) present in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the polyamide 6 resin (A). The polyamide resin composition can provide a molded article having excellent weld properties and is less likely to suffer failure points despite repeated charging and discharging of high-pressure hydrogen.
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