Methods and apparatus for thermally treating a substrate
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United States of America Patent
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Dec 19, 2017
Grant Date -
Mar 31, 2016
app pub date -
Sep 29, 2014
filing date -
Sep 29, 2014
priority date (Note) -
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Abstract
Embodiments of methods and apparatus for thermally treating a substrate are provided herein. In some embodiments, a thermal treatment apparatus includes a chamber body including an interior volume; a plurality of substrate supports disposed within the interior volume, wherein each of the plurality of substrate supports includes a heating element; a selectively sealable opening in the chamber body sized to allow substrates to be inserted into or removed from the interior volume; a robotic arm disposed in the interior volume to move substrates onto and off of the plurality of substrate supports; and a heating assembly configured to heat substrates disposed on the robotic arm.
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