PLATED LEAD FRAME INCLUDING DOPED SILVER LAYER

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United States of America Patent

APP PUB NO 20170365759A1
SERIAL NO

15187314

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED ASSEMBLY MATERIALS INTERNATIONAL LIMITEDUNIT B1 PORTION B 1F GATEWAY TS 8 CHEUNG FAI ROAD TSING YI NT

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KWAN, Yiu Fai Tsuen Wai, HK 10 59
LAM, Yu Lung Kwai Chung, HK 4 11
TSUI, Ching Man Kwai Chung, HK 4 9
YEUNG, Ho Ki Yuen Long, HK 1 0

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