LED thin-film device partial singulation prior to substrate thinning or removal
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United States of America Patent
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Dec 19, 2017
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N/A
app pub date -
Mar 29, 2013
filing date -
Apr 5, 2012
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Abstract
LED dies are partially singulated while on an unthinned depth growth substrate. Slots are made through the streets separating the LED dies, but not through the growth substrate, leaving the now separated LED dies on the growth substrate. A secondary support is attached to the LED dies on the opposite surface from the growth substrate, and the growth substrate is thinned or removed, leaving the LED dies on the secondary support. Because the LED dies are separated while on the unthinned growth substrate, the likelihood of distortion before slicing is virtually eliminated, and the width of the streets between the LED dies may be correspondingly reduced.
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