Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
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United States of America Patent
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Dec 19, 2017
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Apr 18, 2016
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Apr 24, 2015
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Abstract
A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.
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