Semiconductor chip with multilayer solenoid coil and multi-chip module comprising the same
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United States of America Patent
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Dec 19, 2017
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app pub date -
Sep 29, 2016
filing date -
Sep 30, 2015
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Abstract
In accordance with the disclosed semiconductor chip and multi-chip module, signal transmission is made possible between semiconductor chips that are placed on a plane so as to be adjacent to each other through inductive coupling without affecting other coils such as in an oscillation circuit or an antenna circuit for RF communication. A multilayer solenoid coil, where a plane of the coil formed in a multilayer wiring structure in a semiconductor body is parallel to a main surface of the semiconductor body, is formed along at least one side end surface of the semiconductor body.
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