Semiconductor device with wettable corner leads

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United States of America Patent

PATENT NO 9847283
SERIAL NO

15344564

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Abstract

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A semiconductor device has wettable corner leads. A semiconductor die is mounted on a lead frame. Die bonding pads are electrically connected to leads of the lead frame. The die and electrical connections are encapsulated with a mold compound. The leads are exposed and flush with the corners of the device. The leads include dimples so that they are wettable, which facilitates inspection when the device is mounted on a circuit board or substrate.

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Patent Owner(s)

Patent OwnerAddress
NEXPERIA B VJONKERBOSPLEIN 52 NIJMEGEN 6534AB

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chaw, Wing Onn Seremban, MY 2 6
Ho, Wai Keung Kwai Chung, HK 8 108
Ke, Xue Kwai Chung, HK 3 6
Lam, Kan Wae Kwai Chung, HK 14 61
Walczyk, Sven Nijmegan, NL 13 48

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