Semiconductor package and manufacturing method thereof
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United States of America Patent
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Dec 19, 2017
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N/A
app pub date -
Nov 20, 2009
filing date -
Nov 21, 2008
priority date (Note) -
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Abstract
A semiconductor package and a manufacturing method thereof are disclosed. The semiconductor package includes a device carrier and a stiffener structure. The device carrier includes at least one insulating layer and at least conductive layer defining at least one trace layout unit. The stiffener structure is disposed on the device carrier, surrounding the periphery of the at least one trace layout unit. The stiffener structure is disposed away from the periphery of the at least one trace layout unit, forming a cavity with the device carrier. The shape and disposition of the stiffener structure enhance the strength of the semiconductor package, impeding flexure to the semiconductor package.
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