Method for stacking electronic components
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United States of America Patent
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Dec 19, 2017
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app pub date -
Jan 10, 2014
filing date -
Jun 26, 2012
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Abstract
A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes:
- providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination;providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads;providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
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