High-speed RFID tag assembly using impulse heating
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United States of America Patent
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Dec 19, 2017
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app pub date -
Jul 9, 2014
filing date -
Feb 25, 2013
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Abstract
RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.
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