Beryllium-free high-strength copper alloys

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United States of America Patent

PATENT NO 9845520
APP PUB NO 20100243112A1
SERIAL NO

12415510

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Abstract

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A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.

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Patent Owner(s)

Patent OwnerAddress
QUESTEK INNOVATIONS LLC1820 RIDGE AVENUE EVANSTON IL 60201

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Misra, Abhijeet Evanston, US 37 335
Wright, James A Chicago, US 63 1078

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