Flux for soldering and solder paste composition

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9844840
SERIAL NO

14495901

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A flux for soldering includes a base resin, a solvent, and an activating agent. The base resin contains a rosin. An amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to a total amount of the base resin. The activating agent includes a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1).

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
TAMURA CORPORATION1-19-43 HIGASHI-OIZUMI NERIMA-KU TOKYO 1788511

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Masaya Iruma, JP 34 485
Kitamura, Akira Iruma, JP 54 156
Seino, Momoko Iruma, JP 2 1
Tsuchiya, Masahiro Iruma, JP 142 1067

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jun 19, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jun 19, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00