Substrate plating apparatus and substrate plating method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Dec 19, 2017
Grant Date -
Oct 23, 2014
app pub date -
Apr 21, 2014
filing date -
Apr 23, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A substrate plating apparatus is disclosed. The apparatus includes a substrate holder; a plating bath configured to plate a surface of the substrate in a plating solution; a cleaning bath configured to clean the substrate holder and the substrate with a cleaning liquid; an inner shell disposed in the cleaning bath and configured to house the substrate holder holding the substrate therein; and a cleaning liquid supply conduit configured to supply a cleaning liquid into the inner shell to clean the substrate, together with the substrate holder, with the cleaning liquid. The inner shell has an inner surface having an uneven configuration that follows an uneven exterior configuration of the substrate holder holding the substrate.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
EBARA CORPORATION | 11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510 |
International Classification(s)

- 2014 Application Filing Year
- C25D Class
- 592 Applications Filed
- 449 Patents Issued To-Date
- 75.85 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kimura, Masaaki | Tokyo, JP | 63 | 812 |
# of filed Patents : 63 Total Citations : 812 | |||
Minami, Yoshio | Tokyo, JP | 21 | 145 |
# of filed Patents : 21 Total Citations : 145 |
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Patent Citation Ranking
- 0 Citation Count
- C25D Class
- 0 % this patent is cited more than
- 8 Age
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