Substrate plating apparatus and substrate plating method

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United States of America Patent

PATENT NO 9844794
APP PUB NO 20140314957A1
SERIAL NO

14257929

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate plating apparatus is disclosed. The apparatus includes a substrate holder; a plating bath configured to plate a surface of the substrate in a plating solution; a cleaning bath configured to clean the substrate holder and the substrate with a cleaning liquid; an inner shell disposed in the cleaning bath and configured to house the substrate holder holding the substrate therein; and a cleaning liquid supply conduit configured to supply a cleaning liquid into the inner shell to clean the substrate, together with the substrate holder, with the cleaning liquid. The inner shell has an inner surface having an uneven configuration that follows an uneven exterior configuration of the substrate holder holding the substrate.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510

International Classification(s)

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  • 2014 Application Filing Year
  • C25D Class
  • 592 Applications Filed
  • 449 Patents Issued To-Date
  • 75.85 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Masaaki Tokyo, JP 63 812
Minami, Yoshio Tokyo, JP 21 145

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Patent Citation Ranking

  • 0 Citation Count
  • C25D Class
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  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges213330255411101 - 1011 - 2021 - 3031 - 4051 - 6061 - 70100 +020406080100120140160180200220240260280300320340360

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