Strain isolation structures for stretchable electronics
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United States of America Patent
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Dec 12, 2017
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app pub date -
Jun 28, 2016
filing date -
Jun 11, 2012
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Abstract
Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.
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