Plasma treatment apparatus

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United States of America Patent

PATENT NO 9844126
SERIAL NO

13524170

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a plasma treatment apparatus capable of uniform substrate treatment by correction of unevenness in a plasma density distribution. The apparatus has a configuration such that a substrate is treated with plasma, and an evacuated container is provided with an annular antenna arranged around an outer periphery of the container, and is formed of a power supply container, and a process container where the substrate is placed, which communicates with an internal space of the power supply container. The plasma is generated in the power supply container by radio-frequency power supplied to the antenna. The plasma is diffused into the process container by a magnetic field of solenoid coils arranged around an outer periphery of the antenna. The inclination of the magnetic field is adjusted by an inclination adjustment means for adjusting the inclination of the solenoid coils with respect to the process substrate.

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Patent Owner(s)

Patent OwnerAddress
CANON ANELVA CORPORATIONKAWASAKI-SHI KANAGAWA 215-8550

International Classification(s)

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20122013201420152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Masami Tama, JP 36 398
Ikeda, Masayoshi Hachioji, JP 43 797
Kurita, Motozo Fuchu, JP 5 48
Sago, Yasumi Tachikawa, JP 27 721
Sakamoto, Kiyotaka Tama, JP 8 83
Sawada, Akihiro Kawasaki, JP 62 621

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  • 2 Citation Count
  • C23C Class
  • 27.20 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4219241045322915232201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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